Electrotechnology experts gather in São Paulo
18 November 2008
More than 1 000 engineers, business leaders, technologists and representatives from governments from 53 countries are gathering in São Paulo, Brazil, for the 72nd General Meeting of the International Electrotechnical Commission – the IEC – the world leading organisation that prepares and publishes International Standards for all electrical, electronic and related technologies – collectively known as "electrotechnology".
Experts in the fields from electrical energy efficiency, power transformers, the safety of electrical equipment, the universal plug and socket, to the latest multimedia technologies, are meeting in Brazil's business capital from 17-21 November 2008. They will be helping to set the new International Standards in electrical and electronic equipment and systems that are used in 155 countries around the world to improve safety, increase efficiency and protect the environment.
Against the backdrop of the financial crisis facing the world's economies, four of the world's leading experts in IT and multimedia technologies will be addressing the options open to countries to achieve sustainable development and high technology at a special session on Friday 21 November 2008. They are: Shuji Hirakawa, from Toshiba Corporation, who is Secretary of IEC's technical committee which sets International Standards for audio, video and multimedia systems and equipment (TC 100); Scott Jameson, from Hewlett-Packard, who is Chairman of the joint IEC and ISO technical committee on information technology (ISO/IEC JTC 1); João Alziro Herz da Jornada, President of Brazil's National Institute of Metrology, Standardization and Industrial Quality, INMETRO; and Frans Vreeswijk, from Philips, who is President of the IEC's Dutch National Committee and an IEC Council Board member.
The IEC General Meeting is being hosted by COBEI – The Brazilian Committee of Electricity, Electronics, Illumination and Telecommunications – which is celebrating its 100th anniversary in 2008.
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